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Optimization of a silicone under the bump (SUB) structure for wafer level packaging

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.contributor.authorLee, Y.J.
dc.contributor.authorLarson, L.
dc.contributor.authorHarkness, B.R.
dc.contributor.authorMohamed, M.
dc.contributor.authorMeynen, H.
dc.date.accessioned2021-10-15T04:48:52Z
dc.date.available2021-10-15T04:48:52Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7619
dc.sourceIIOimport
dc.titleOptimization of a silicone under the bump (SUB) structure for wafer level packaging
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage479
dc.source.endpage484
dc.source.conferenceProceedings of the 14th European Microelectronic Packaging Conference and Exhibition - IMAPS Europe
dc.source.conferencedate23/06/2003
dc.source.conferencelocationFriedrichshafen Germany
imec.availabilityPublished - imec


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