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Direct gold and copper wires bonding on copper

dc.contributor.authorHo, Meng
dc.contributor.authorLam, Wai
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorRatchev, Petar
dc.contributor.authorVath, Charles J.
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T04:55:32Z
dc.date.available2021-10-15T04:55:32Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7656
dc.sourceIIOimport
dc.titleDirect gold and copper wires bonding on copper
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage913
dc.source.endpage923
dc.source.journalMicroelectronics Reliability
dc.source.issue6
dc.source.volume43
imec.availabilityPublished - open access
imec.internalnotesPaper from the GaAs Reliability Workshop; 20 Oct. 2002; Monterey, CA, USA


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