Show simple item record

Technology for very dense hybrid detector arrays using electroplated indium solderbumps

dc.contributor.authorMerken, Patrick
dc.contributor.authorJohn, Joachim
dc.contributor.authorZimmermann, Lars
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-15T05:43:30Z
dc.date.available2021-10-15T05:43:30Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7897
dc.sourceIIOimport
dc.titleTechnology for very dense hybrid detector arrays using electroplated indium solderbumps
dc.typeJournal article
dc.contributor.imecauthorJohn, Joachim
dc.contributor.imecauthorVan Hoof, Chris
dc.source.peerreviewno
dc.source.beginpage60
dc.source.endpage64
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue1
dc.source.volume26
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record