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Comparison of different flex materials in high density flip chip on flex applications

dc.contributor.authorPalm, P.
dc.contributor.authorMäättänen, J.
dc.contributor.authorDe Maquillé, Y.
dc.contributor.authorPicault, A.
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.date.accessioned2021-10-15T05:59:08Z
dc.date.available2021-10-15T05:59:08Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7968
dc.sourceIIOimport
dc.titleComparison of different flex materials in high density flip chip on flex applications
dc.typeJournal article
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage445
dc.source.endpage451
dc.source.journalMicroelectronics Reliability
dc.source.issue3
dc.source.volume43
imec.availabilityPublished - open access


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