dc.contributor.author | Parton, Els | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | Ratchev, Petar | |
dc.date.accessioned | 2021-10-15T06:01:42Z | |
dc.date.available | 2021-10-15T06:01:42Z | |
dc.date.issued | 2003-10 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7979 | |
dc.source | IIOimport | |
dc.title | Packaging research goes lead-free: a microscopic look on reliability issues | |
dc.type | Journal article | |
dc.contributor.imecauthor | Parton, Els | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 38 | |
dc.source.endpage | 41 | |
dc.source.journal | Printed Circuit Europe | |
imec.availability | Published - open access | |