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Packaging research goes lead-free: a microscopic look on reliability issues

dc.contributor.authorParton, Els
dc.contributor.authorGonzalez, Mario
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorRatchev, Petar
dc.date.accessioned2021-10-15T06:01:42Z
dc.date.available2021-10-15T06:01:42Z
dc.date.issued2003-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7979
dc.sourceIIOimport
dc.titlePackaging research goes lead-free: a microscopic look on reliability issues
dc.typeJournal article
dc.contributor.imecauthorParton, Els
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage38
dc.source.endpage41
dc.source.journalPrinted Circuit Europe
imec.availabilityPublished - open access


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