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Paving the way for copper-to-copper wire bonding by thorough optimization - Oxide prevention is the key

dc.contributor.authorVan Bavel, Mieke
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T07:05:59Z
dc.date.available2021-10-15T07:05:59Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8243
dc.sourceIIOimport
dc.titlePaving the way for copper-to-copper wire bonding by thorough optimization - Oxide prevention is the key
dc.typeJournal article
dc.contributor.imecauthorVan Bavel, Mieke
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage72
dc.source.endpage75
dc.source.journalEPP Europe
dc.source.issue11_12
imec.availabilityPublished - imec


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