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dc.contributor.authorVandevelde, Bart
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoose, E.
dc.contributor.authorCorlatan, D.
dc.contributor.authorSwaelen, G.
dc.contributor.authorWillems, G.
dc.contributor.authorChristiaens, F.
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.date.accessioned2021-10-15T07:30:13Z
dc.date.available2021-10-15T07:30:13Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8334
dc.sourceIIOimport
dc.titleModified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage307
dc.source.endpage318
dc.source.journalMicroelectronics Reliability
dc.source.issue2
dc.source.volume43
imec.availabilityPublished - open access


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