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Accurate RF electrical characterisation of CSPs using MCM-D thin film technology

dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.date.accessioned2021-10-15T12:50:47Z
dc.date.available2021-10-15T12:50:47Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8669
dc.sourceIIOimport
dc.titleAccurate RF electrical characterisation of CSPs using MCM-D thin film technology
dc.typeJournal article
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage203
dc.source.endpage212
dc.source.journalIEEE Trans. Advanced Packaging
dc.source.issue1
dc.source.volume27
imec.availabilityPublished - imec


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