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Mechanical issues of Cu to Cu wire bonding

dc.contributor.authorChen, Jian
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorRatchev, Petar
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T12:51:05Z
dc.date.available2021-10-15T12:51:05Z
dc.date.issued2004-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8672
dc.sourceIIOimport
dc.titleMechanical issues of Cu to Cu wire bonding
dc.typeJournal article
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage539
dc.source.endpage545
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue3
dc.source.volume27
imec.availabilityPublished - imec


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