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Mechanical FEM simulation of bonding process on Cu lowK wafers

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T13:10:52Z
dc.date.available2021-10-15T13:10:52Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8822
dc.sourceIIOimport
dc.titleMechanical FEM simulation of bonding process on Cu lowK wafers
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage643
dc.source.endpage650
dc.source.journalIEEE Trans. Components and Packaging Technologies
dc.source.issue4
dc.source.volume27
imec.availabilityPublished - imec


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