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Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish

dc.contributor.authorRatchev, Petar
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-15T15:46:07Z
dc.date.available2021-10-15T15:46:07Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9497
dc.sourceIIOimport
dc.titleReliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage5
dc.source.endpage10
dc.source.journalIEEE Trans. Device and Materials Reliability
dc.source.issue1
dc.source.volume4
imec.availabilityPublished - imec


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