| dc.contributor.author | Siau, S. | |
| dc.contributor.author | De Baets, Johan | |
| dc.contributor.author | Van Calster, Andre | |
| dc.contributor.author | Heremans, L. | |
| dc.contributor.author | Tanghe, S. | |
| dc.date.accessioned | 2021-10-15T16:12:22Z | |
| dc.date.available | 2021-10-15T16:12:22Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9589 | |
| dc.source | IIOimport | |
| dc.title | Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards | |
| dc.type | Journal article | |
| dc.contributor.imecauthor | De Baets, Johan | |
| dc.contributor.imecauthor | Van Calster, Andre | |
| dc.source.peerreview | no | |
| dc.source.journal | Microelectronic Reliability | |
| imec.availability | Published - imec | |
| imec.internalnotes | In Press, Corrected proof available online 11 September 2004; to be publ in 2005 | |
