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Influence of solder joint shape on the thermo-mechanical reliability of CSP's

dc.contributor.authorvan Veen, Co
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-15T17:17:59Z
dc.date.available2021-10-15T17:17:59Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9803
dc.sourceIIOimport
dc.titleInfluence of solder joint shape on the thermo-mechanical reliability of CSP's
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage53
dc.source.endpage63
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.issue2
dc.source.volume1
imec.availabilityPublished - imec


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