Show simple item record

Package and solder joint reliability analysed by FEM simulation and experiments

dc.contributor.authorVandevelde, Bart
dc.contributor.authorAndersson, Dag
dc.date.accessioned2021-10-15T17:25:37Z
dc.date.available2021-10-15T17:25:37Z
dc.date.issued2004-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9827
dc.sourceIIOimport
dc.titlePackage and solder joint reliability analysed by FEM simulation and experiments
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.beginpage1891
dc.source.endpage1892
dc.source.journalMicroelectronics Reliability
dc.source.issue12
dc.source.volume44
imec.availabilityPublished - imec
imec.internalnotesGuest editorial


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record