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Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies

dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorVandepitte, D.
dc.contributor.authorBaelmans, M.
dc.date.accessioned2021-10-15T17:25:55Z
dc.date.available2021-10-15T17:25:55Z
dc.date.issued2004-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9828
dc.sourceIIOimport
dc.titleAnalytical thermo-mechanical model for non-underfilled area array flip chip assemblies
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage351
dc.source.endpage358
dc.source.journalJournal of Electronic Packaging
dc.source.issue3
dc.source.volume126
imec.availabilityPublished - imec


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