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The influence of a structurally induced current crowding on electromigration

dc.contributor.authorWang, Hui
dc.contributor.authorBruynseraede, Christophe
dc.contributor.authorChiaradia, David
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T17:49:14Z
dc.date.available2021-10-15T17:49:14Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9900
dc.sourceIIOimport
dc.titleThe influence of a structurally induced current crowding on electromigration
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage241
dc.source.endpage244
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume76
imec.availabilityPublished - imec
imec.internalnotesMaterials for Advanced Metalization, March 2004, Brussels, Belgium


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