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Corrosion inhibition by thiol-derived SAMs for enhanced wire bonding on Cu surfaces

dc.contributor.authorWhelan, Caroline
dc.contributor.authorKinsella, Michael
dc.contributor.authorHong, Meng Ho
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T17:54:10Z
dc.date.available2021-10-15T17:54:10Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9915
dc.sourceIIOimport
dc.titleCorrosion inhibition by thiol-derived SAMs for enhanced wire bonding on Cu surfaces
dc.typeJournal article
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpageB33
dc.source.endpageB38
dc.source.journalJ. Electrochem. Soc.
dc.source.issue2
dc.source.volume151
imec.availabilityPublished - imec


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