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Fabrication and transport properties of ultra-fine copper interconnects

dc.contributor.authorWu, Wen
dc.date.accessioned2021-10-15T18:01:09Z
dc.date.available2021-10-15T18:01:09Z
dc.date.issued2004-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9936
dc.sourceIIOimport
dc.titleFabrication and transport properties of ultra-fine copper interconnects
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorMaex, Karen
imec.availabilityPublished - open access


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