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Grain growth in copper interconnect lines

dc.contributor.authorWu, Wen
dc.contributor.authorErnur, Didem
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T18:02:10Z
dc.date.available2021-10-15T18:02:10Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9939
dc.sourceIIOimport
dc.titleGrain growth in copper interconnect lines
dc.typeJournal article
dc.contributor.imecauthorErnur, Didem
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage190
dc.source.endpage194
dc.source.journalMicroelectronic Engineering
dc.source.issue1_4
dc.source.volume76
imec.availabilityPublished - imec


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