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High frequency modelling of on-chip interconnects considering conductor and substrate skin effects

dc.contributor.authorYmeri, H.
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T18:10:41Z
dc.date.available2021-10-15T18:10:41Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9964
dc.sourceIIOimport
dc.titleHigh frequency modelling of on-chip interconnects considering conductor and substrate skin effects
dc.typeJournal article
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage35
dc.source.endpage38
dc.source.journalMicroelectronics International
dc.source.issue1
dc.source.volume21
imec.availabilityPublished - open access


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