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A physics-based VLSI interconnect model including substrate and conductor skin effects

dc.contributor.authorYmeri, H.
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorMaex, Karen
dc.contributor.authorDe Roest, David
dc.date.accessioned2021-10-15T18:11:00Z
dc.date.available2021-10-15T18:11:00Z
dc.date.issued2004
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9965
dc.sourceIIOimport
dc.titleA physics-based VLSI interconnect model including substrate and conductor skin effects
dc.typeJournal article
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorDe Roest, David
dc.source.peerreviewno
dc.source.beginpage516
dc.source.endpage518
dc.source.journalSemiconductor Science and Technology
dc.source.issue3
dc.source.volume19
imec.availabilityPublished - imec


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