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Lateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure

dc.contributor.authorAbell, Thomas
dc.contributor.authorSchuhmacher, Jorg
dc.contributor.authorTokei, Zsolt
dc.contributor.authorTravaly, Youssef
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-16T00:42:20Z
dc.date.available2021-10-16T00:42:20Z
dc.date.issued2005
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/9993
dc.sourceIIOimport
dc.titleLateral solvent diffusion characterization of low k dielectric plasma damage and ALD barrier film closure
dc.typeJournal article
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage411
dc.source.endpage415
dc.source.journalMicroelectronic Engineering
dc.source.issue3_4
dc.source.volume82
imec.availabilityPublished - imec
imec.internalnotesProc. 9th Eur. Workshop on Materials for Advanced Metallization; March 2005; Dresden


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