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Browsing by Author "Attard, A."

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    3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

    Daily, Robert
    ;
    Capuz, Giovanni  
    ;
    Wang, Teng
    ;
    Bex, Pieter  
    ;
    Struyf, Herbert  
    ;
    Sleeckx, Erik  
    Meeting abstract
    2015, International Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC, 14/04/2015, p.56-60

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