Browsing by Author "Attard, A."
Now showing 1 - 1 of 1
- Results Per Page
- Sort Options
Publication 3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly
Meeting abstract2015, International Conference on Electronic Packaging & iMAPS All Asia Conference - ICEP-IACC, 14/04/2015, p.56-60