Browsing by Author "Bergmans, J."
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Publication A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package
Journal article1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.265-271Publication Thermal modelling of polymer stud grid array (PSGA) package
Journal article1998, IMAPS International Journal of Microcircuits and Electronic Packaging, (20) 4, p.521-532Publication Thermomechanical models for leadless solder interconnections in flip chip assemblies
Journal article1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.177-85