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    Cu/SiCN Wafer-to-Wafer Hybrid Bonding Interface Reliability Down to 400 nm Pitch

    Chery, Emmanuel  
    ;
    Chew, Soon Aik  
    ;
    Bermond, Theo
    ;
    Zhang, Boyao  
    ;
    Beyne, Eric  
    Proceedings paper
    2025, IEEE 27th Electronics Packaging Technology Conference (EPTC), 2025-12-02, p.1-6

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