Browsing by Author "Bhawmik, Sudipta"
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Publication 3D-COSTAR: A cost model for 3D stacked ICs
Oral presentation2013, Friday Workshop on 3D Integration at Design, Automation and Test in Europe - DATEPublication 3D-COSTAR: A cost model for 3D-SICs
Proceedings paper2012-11, IEEE International Workshop on Testing Three-Dimensional Stacked ICs - 3D-TEST, 8/11/2012Publication 3D-COSTAR: A cost model for 3D-SICs
Proceedings paper2012-12, 3-D Architectures for Semiconductor Integration and Packaging - 3D-ASIP, 12/12/2012Publication Impact of mid-bond Testing in 3D stacked ICs
Proceedings paper2013-10, IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems - DFT, 2/10/2013, p.178-183Publication Using 3D-COSTAR for 2.5D test cost optimization
Proceedings paper2013-10, IEEE International 3D Systems Integration Conference - 3DIC, 2/10/2013, p.1-8