Browsing by Author "Caers, J.F.J.M."
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Publication Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives
Proceedings paper2003, Proceedings of the Business of Electronic Product Reliability and Reliability, 13/01/2003Publication Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
Journal article2002, IEEE Trans. Electronics Packaging Manufacturing, (25) 4, p.318-325