Browsing by Author "Christiaens, W."
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Publication Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective
Proceedings paper2007, Proceedings 16th European Microelectronics and Packaging Conference - EMPC, 17/06/2007, p.25-30Publication UTCP : 60 µm Thick Bendable Chip Package
Proceedings paper2006-11, Wafer Level Packaging Symposium, 2006-11-01