Browsing by Author "Coello-Vera, A."
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Publication Residual thermo-mechanical stresses in thinned-chip assemblies
Proceedings paper1999, Proceedings of 5th International Workshop on Thermal Investigations of ICs and Microstructures - THERMINIC, 3/10/1999, p.306-311Publication Residual thermomechanical stresses in thinned-chip assemblies
Journal article2000, IEEE Trans. Components and Packaging Technologies, (23) 4, p.673-679Publication UTCS: ultra thin chip stacking a WSI emulation technology
Proceedings paper2000, 3rd Round Table on Micro/Nano-Technologies for Space, 15/05/2000, p.81-84