Browsing by Author "Daily, R."
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Publication A Process Level Comparative Analysis Between D2W Local and Collective 3D Bonding
Proceedings paper2013, 10th Wafer-Level Packaging Symposium, 2013-11-06Publication Exploring Process Interaction of No-Flow Underfill and Thermo-Compression Bonding in D2D Stacking
Proceedings paper2013, 10th Wafer-Level Packaging Symposium, 2013-11-06Publication Understanding the Stacked Dies Interface Temperature and its Influence During The 3D IC Thermocompression Stacking Process
Proceedings paper2012, 9th Wafer-Level Packaging Symposium, 2012-11-05