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Browsing by Author "De Kerckhove, Alex"

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    Indium solder bump technology for ultra high density interconnects in hybrid image sensors

    John, Joachim  
    ;
    De Moor, Piet  
    ;
    Colin, Thierry
    ;
    De Kerckhove, Alex
    ;
    Borgers, Tom  
    ;
    Hooylaerts, Peter  
    Proceedings paper
    2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS/EMPC, 12/06/2005, p.334-337

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