Browsing by Author "De Kerckhove, Alex"
Now showing 1 - 1 of 1
- Results per page
- Sort Options
Publication Indium solder bump technology for ultra high density interconnects in hybrid image sensors
; ; ;Colin, Thierry ;De Kerckhove, Alex; Proceedings paper2005-06, Proceedings of the 15th European Microelectronics and Packaging Conference & Exhibition - IMAPS/EMPC, 12/06/2005, p.334-337