Browsing by Author "Degrande, S."
Now showing 1 - 2 of 2
- Results per page
- Sort Options
Publication Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Journal article2005, Journal of the Electrochemical Society, (152) 9, p.d136-d150Publication Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Journal article2005, Applied Surface Science, (245) 1, p.353-368