Browsing by Author "Dy, Eric"
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Publication An IC-centric biocompatible chip encapsulation fabrication process
Proceedings paper2010, Electronics System Integratio Technology Conference - ESTC, 13/09/2010Publication Biocompatibility assessment of advanced wafer-level based chip encapsulation
Proceedings paper2010, Electronics System Integration Technology Conference - ESTC, 13/09/2010Publication High-volume wafer-level production of hyperspectral sensors for handheld devices
Oral presentation2013, Trillion Sensors SummitPublication Wearable sensors for healthier pregnancies
Journal article2015, Proceedings of the IEEE, (103) 2, p.179-191