Browsing by Author "Eichhammer, Y."
Now showing 1 - 2 of 2
- Results per page
- Sort Options
Publication 3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
Proceedings paper2019, IEEE 69th Electronic Components and Technology Conference - ECTC, 25/05/2019, p.1052-1059Publication 5G mm wave networks leveraging enhanced fiber-wireless convergence for high-density environments: The 5G-PHOS approach