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Browsing by Author "Eichorst, Michael"

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    Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

    Vandevelde, Bart  
    ;
    Labie, Riet  
    ;
    Lauwaert, Ralph
    ;
    Dudek, Rainer
    ;
    Gromala, Przemyslaw
    Proceedings paper
    2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023

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