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Browsing by Author "Fang, Yu"

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    BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure

    Fang, Yu  
    ;
    Lesniewska, Alicja  
    ;
    Ciofi, Ivan  
    ;
    Roussel, Philippe  
    ;
    Wu, Chen  
    ;
    Vega Gonzalez, Victor  
    Proceedings paper
    2024, International Reliability Physics Symposium (IRPS), APR 14-18, 2024
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    Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps

    Lesniewska, Alicja  
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    Fang, Yu  
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    Delie, Gilles  
    ;
    Roussel, Philippe  
    ;
    Van Sever, Koen  
    ;
    Chery, Emmanuel  
    Proceedings paper
    2025-01-01, 2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2025-03-30
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    Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects

    Fang, Yu  
    ;
    Ciofi, Ivan  
    ;
    Roussel, Philippe  
    ;
    Lesniewska, Alicja  
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    Degraeve, Robin  
    ;
    De Wolf, Ingrid  
    Journal article
    2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 18, p.4332-4337
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    Local Electric Field-Aware 3D TDDB model for BEOL reliability predictions

    Fang, Yu  
    ;
    Lesniewska, Alicja  
    ;
    Ciofi, Ivan  
    ;
    Roussel, Philippe  
    ;
    De Wolf, Ingrid  
    ;
    Croes, Kristof  
    Proceedings paper
    2025-01-01, 2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2025-03-30
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    Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects

    Fang, Yu
    ;
    Ciofi, I.
    ;
    Roussel, Ph. J.
    ;
    Lesniewska, A.
    ;
    Carballo, V. M. Blanco
    ;
    Degraeve, R.
    ;
    Wolf, I. De
    Journal article
    2025-APR 7, IEEE TRANSACTIONS ON ELECTRON DEVICES

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