Browsing by Author "Fang, Yu"
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Publication BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure
Proceedings paper2024, International Reliability Physics Symposium (IRPS), APR 14-18, 2024Publication Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps
; ; ; ; ; Proceedings paper2025-01-01, 2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2025-03-30Publication Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch Interconnects
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 18, p.4332-4337Publication Local Electric Field-Aware 3D TDDB model for BEOL reliability predictions
Proceedings paper2025-01-01, 2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2025-03-30Publication Three-Dimensional Modeling of BEOL TDDB: Variability Specs for Sub-20 nm Half-Pitch Interconnects
;Fang, Yu ;Ciofi, I. ;Roussel, Ph. J. ;Lesniewska, A. ;Carballo, V. M. Blanco ;Degraeve, R.Wolf, I. DeJournal article2025-APR 7, IEEE TRANSACTIONS ON ELECTRON DEVICES