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Browsing by Author "Gonzalez, M."

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    Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

    Degryse, Dominiek
    ;
    Labie, Riet  
    ;
    Vandevelde, Bart  
    ;
    Gonzalez, M.
    ;
    Beyne, Eric  
    Proceedings paper
    2002, Proceedings of the 3rd Eurosime Conference, 14/04/2002, p.316-321

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