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Browsing by Author "Gromala, Przemyslaw"

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    Exchanging Thermo-Mechanical Simulation Models independent on FEM Software Platform

    Vandevelde, Bart  
    ;
    Nawghane, Chinmay  
    ;
    Dudek, Rainer
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    Doering, Ralf
    ;
    Schindele, Jens
    Proceedings paper
    2022, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 25-27, 2022
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    Numerical investigations on 1st and 2nd level thermo-mechanical reliability of mock-up for high performance vehicle computers

    Dudek, Rainer
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    Doring, Ralf
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    Rzepka, Sven
    ;
    Gromala, Przemyslaw
    ;
    Vandevelde, Bart  
    Proceedings paper
    2020, EuWoRel Workshop, 21/10/2020
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    Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints

    Vandevelde, Bart  
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    Labie, Riet  
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    Lauwaert, Ralph
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    Dudek, Rainer
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    Gromala, Przemyslaw
    Proceedings paper
    2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023
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    Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System

    Dudek, Rainer
    ;
    Doring, Ralf
    ;
    Rzepka, Sven
    ;
    Gromala, Przemyslaw
    ;
    Schindele, Jens
    Proceedings paper
    2021, 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 19-22, 2021

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