Browsing by Author "Gromala, Przemyslaw"
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Publication Exchanging Thermo-Mechanical Simulation Models independent on FEM Software Platform
Proceedings paper2022, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 25-27, 2022Publication Numerical investigations on 1st and 2nd level thermo-mechanical reliability of mock-up for high performance vehicle computers
Proceedings paper2020, EuWoRel Workshop, 21/10/2020Publication Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
Proceedings paper2023, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 16-19, 2023Publication Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
;Dudek, Rainer ;Doring, Ralf ;Rzepka, Sven ;Gromala, PrzemyslawSchindele, JensProceedings paper2021, 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 19-22, 2021