Browsing by Author "Guittet, Pierre-Yves"
Now showing 1 - 3 of 3
- Results per page
- Sort Options
Publication High speed full wafer monitoring of surface, edge and bonding interface for 3D-stacking
Proceedings paper2011, 13th Electronics Packaging Technology Conference - EPTC, 7/11/2011Publication In-line process variance monitoring of advanced 3D TSV production lines
Journal article2010, Future Fab International, 34, p.94-101Publication Ultra-fast in-line metrology for 3D SIC TSV line - Bonding & thinning
Meeting abstract2010, 10th International Symposium on Ultra Clean Processing of Semiconductor Interfaces - UCPSS, 19/09/2010, p.184-185