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Browsing by Author "Hagedorn, H. W."

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    Electro-conductive adhesives for high density package and flip-chip interconnections

    Wojciechowski, Dominique
    ;
    Vanfleteren, Jan  
    ;
    Reese, E.
    ;
    Hagedorn, H. W.
    Journal article
    2000, Microelectronics Reliability, (40) 7, p.1215-1226

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