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Browsing by Author "He, Dongming"

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    Study of intermetallic compound evolution of pure Sn and SnAg alloy solder on single and multi-layer under-bump materials

    Hussain, Tassawar  
    ;
    Derakhshandeh, Jaber  
    ;
    Cochet, Tom  
    ;
    Beyne, Eric  
    ;
    Hsu, Jack
    ;
    He, Dongming
    Proceedings paper
    2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024

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