Browsing by Author "Heermann, M."
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Publication CIMID, a technology for high density integration of electronic systems
; ; ;Roggen, Jean; ;Heermann, M. ;Gouwy, G.Bulcke, F.Oral presentation1994, Workshop on MCM and VLSI Packaging Techniques and Manufacturing TechnologiesPublication CIMID, A technology for high density integration of electronic systems
Proceedings paper1994, Proceedings of 27th International Symposium on Microelectronics - ISHM'94, 15/11/1994, p.226-231Publication Thin film polymer layers for molded smart cards, CIMID technology
Oral presentation1994, Dow's 3rd MCM Workshop