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Browsing by Author "Hidremont, Romain"

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    One micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material

    Flack, Warren
    ;
    Hsieh, Robert
    ;
    Nguyen, Ha-Ai
    ;
    Slabbekoorn, John  
    ;
    Suhard, Samuel  
    ;
    Miller, Andy  
    Proceedings paper
    2018, 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 4/12/2018, p.395-400

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