Browsing by Author "Horsfall, A."
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Publication Design and application of a sensor to monitor stress in deep submicron copper interconnects
Proceedings paper2010, Stress-Induced Phenomena in Metallization: 11th International Workshop, 11/04/2010, p.133-138Publication Simulation of the effect of microstructure on the elastic properties of copper interconnects
; ;Oila, A. ;Sanderson, L. ;Bull, S. ;Raskin, Jean-Pierre; Horsfall, A.Oral presentation2010, 11th International Workshop on Stress-Induced Phenomena in Metallization