Browsing by Author "Hsu, A."
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Publication Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration
Proceedings paper2024, 2024 International Interconnect Technology Conference, 2024-06-03Publication Electrical test demonstration for 0.55 NA EUV single patterning damascene process
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02Publication Patterning process and electrical yield optimization at the limits of single exposure EUV 0.33 NA: a pitch 26nm damascene process
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