Browsing by Author "Hua, Fay"

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Metallurgies evaluation (Sn vs. SnCu0.7% vs. SnAg) for 3D bumping and stacking

Vakanas, George
;
Wang, Teng
;
Tatsumi, Koji
;
Marinissen, Erik Jan
;
Rebibis, Kenneth June
Meeting abstract
2014, TMS Annual Meeting & Exhibition, 16/02/2014
Whisker evaluations in 3D microbump structures

Vakanas, George
;
Vandecasteele, Bjorn
;
De Messemaeker, Joke
;
Willems, Geert
;
La Manna, Antonio
Meeting abstract
2014, 143 rd TMS Annual Meeting and Exhibition, 16/02/2014