Browsing by Author "Ignat, M."
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Publication Analysis of local mechanical stresses in and near tungsten lines on silicon substrates
Journal article1999, J. Appl. Phys., (85) 9, p.6477-6485Publication Damage evolution and mechanical failure in flip-chip interconnects
Proceedings paper1998, Electronic Packaging and Materials Science X, 14/04/1998, p.105-110Publication Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections
Proceedings paper1997, Proceedings of the International Conference and Exhibition Micro Materials - Micro Mat, 16/04/1997, p.261-266Publication Experimental validation of mechanical stress models by micro-Raman spectroscopy
; Publication Experimental validation of mechanical stress models by micro-Raman spectroscopy
; Publication Finite element simulations of the mechanical stress in and around TiSi2 lines
Proceedings paper1998, Micromechanical Structures for Materials Research, 15/04/1998, p.227-232Publication Residual stresses in tungsten lines: analysis of experimental (micro-Raman spectroscopy, XRD) and numerical results
Proceedings paper1995, Materials Reliability in Microelectronics V, 17/04/1995, p.109-114