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Browsing by Author "Kim, Jisoo"

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    A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond

    Op de Beeck, Maaike  
    ;
    Versluijs, Janko  
    ;
    Tokei, Zsolt  
    ;
    Demuynck, Steven  
    ;
    de Marneffe, Jean-Francois  
    Proceedings paper
    2007, Advances in Resist Materials and Processing Technology XXIV, 25/02/2007, p.65190U

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