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Browsing by Author "Koch, F."

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    Characterization of the B and As pile-up at the Si-SiO2 interface

    Fruehauf, Jens
    ;
    Lindsay, Richard
    ;
    Vandervorst, Wilfried  
    ;
    Maex, Karen  
    ;
    Bergmaier, A.
    Proceedings paper
    2003, Ultra Shallow Junctions. 7th Int. Worksh. Fabrication, Characterization and Modeling of Ultra Shallow Doping Profiles in Semic., 27/04/2003, p.399-404

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