Browsing by Author "Ku, Bon Woong"
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Publication How much cost reduction justifies the adoption of monolithic 3D ICs at 7nm node?
Proceedings paper2016, International Conference on Computer-Aided Design - ICCAD, 7/11/2016, p.Art. 87Publication Physical design solutions to tackle FEOL/BEOL degradation in gate-level monolithic 3D ICs
Proceedings paper2016, Proceedings of the International Symposium on Low Power Electronics and Design - ISLPED, 8/08/2016, p.76-81